Xilinx® Authorized Training Provider Courses > FPGA Design/Architecture > Signal Integrity and Board Design for Xilinx FPGA's
Signal Integrity and Board Design for Xilinx FPGA's

Learn when and how to apply signal integrity techniques to high-speed interfaces between Xilinx FPGAs and other components. This comprehensive course combines design techniques and methodology with relevant background concepts of high-speed bus and clock design, including transmission line termination, loading, and jitter.
 
You will work with IBIS models and complete simulations using Mentor Graphics HyperLynx. Other topics include managing PCB effects and on-chip termination. This course balances lecture modules with instructor demonstrations and practical hands-on labs.

 

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Who Should Attend

Digital designers, board layout designers, or scientists, engineers, and technologists seeking to implement Xilinx solutions. Also end users of Xilinx products who want to understand how to implement high-speed interfaces without incurring the signal integrity problems related to timing, crosstalk, and overshoot or undershoot infractions.

 



At-A-Glance

Schedule

  • Course No:  SI20000-ILT
  • Course Duration:  3 Days
  • Price:  USD $2,100
    or 21 Xilinx Training Credits
  • Level: Intermediate
  • Prerequisites

    • FPGA design experience preferred (Essentials of FPGA Design course or equivalent)
    • Familiarity with high-speed PCB concepts
    • Basic knowledge of digital and analog circuit design
    • ISE® tool knowledge is helpful

     

  • Software Tools

    • ISE Design Suite 12.1
    • PlanAhead™ software 12.1
    • Mentor Graphics HyperLynx 8.0 or later

     

  • October 26-28, 2010
    Orange County, CA

    Doubletree - Orange County Airport

    7 Hutton Centre Dr.

    Santa Ana, California,

    United States 92707-5794


    Tel: 1-714-751-2400   Fax: 1-714-662-7935

     


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COURSE OUTLINE

Part 1 – Signal Integrity

Signal Integrity Introduction

Transmission Lines

IBIS Models and SI Tools

Lab 1: Invoking HyperLynx

Reflections

Lab 2: Reflection Analysis

Crosstalk

Lab 3: Crosstalk Analysis

Signal Integrity Analysis

Power Supply Issues

Signal Integrity Summary

 

Part 2 – Board Design

Board Design Introduction

FPGA Power Supply

Lab 4: Power Prediction

FPGA Configuration and PCB

Signal Interfacing: Interfacing in General

Signal Interfacing: FPGA-Specific Interfacing

Lab 5: I/O Pin Planning

Die Architecture and Packaging

PCB Details

Thermal Aspects

Lab 6: Thermal Design

Tools for PCB Planning and Design

Board Design Summary

 

LAB DESCRIPTION

  • Lab 1: Invoking HyperLynx – Become familiar with signal integrity tools. Use HyperLynx for schematic entry, modeling, and simulation. Modify a standard IBIS model to define a driver and then use its stackup editor to define a PCB.
  • Lab 2: Reflection Analysis – Define a circuit and run various simulations for effects of reflection.
  • Lab 3: Crosstalk Analysis – Using simulation, analyze circuit topology and PCB data for strategies to minimize crosstalk.
  • Lab 4: Power Prediction – Estimate initial power requirements using an Excel spreadsheet, then use XPower Analyzer to accurately predict board power needs.
  • Lab 5: Pin Planning – Use the PlanAhead software to identify pin placement and implement pin assignments.
  • Lab 6: Thermal Design – Determine maximum junction temperature and calculate acceptable thermal resistance.

 


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